KAUAI – The program for the 20th Annual Pan Pacific Microelectronics Symposium has been finalized and will take place Feb. 2-5 at the Sheraton Kauai Resort.

More than 50 technical sessions will take place, covering power electronics, processing, emerging technologies, materials, electronics packaging, failure analysis and reliability, interconnects, nano electronic packaging, and 2.5/3D interposers.

This year's event features several keynote presentations:

·         Yasumitsu Orii, IBM, will present Perspective on Required Packaging Technologies for Cognitive Computing Devices.

·         Kim Il Ung, SK CNC, will present Memory Markets and Applications: Future Outlook.

·         Shen Li Fu, PhD, I-Shou University, will share Trends of 3D IC/3D Packaging for Mobile & Wearable Electronics.

·         Horatio Quinones, Ph.D., FDCS, will present In-situ Control Systems in Manufacturing.

·         Klaus-Dieter Lang, Ph.D., Fraunhofer IZM, will present Advanced Integration Technologies for Cyber Physical Systems.

·         John Quackenbush, Dana-Farber Cancer Institute and Harvard School of Public Health, will present The Coming of Big Data in Health
Care and Biomedical Research.

·         Dongkai Shangguan, Ph.D., NCAP China, will discuss 3D Packaging and System Integration.

·         Kim Gu Sung, EP Works, Kangnam University, will present Low Cost Through Silicon Via (TSV) Technologies.

For more information, visit http://www.smta.org/panpac.