CEDEX, FRANCE – The ETSI’s Industry Specification Group for Surface Mount Technique has released its group specification for embedded communication modules for M2M communications.

ETSI’s specification for embedded communication modules, GS SMT 001, provides common physical specifications or form factors and common electrical characteristics for modules. This will enable widespread adoption of common form factors, allowing an easier transition to next-generation communication modules for device developers and systems integrators, says the group.

The specification covers electrical as well as mechanical aspects, including the I/O interfaces, their assignment to pads, pad placement and module dimensions. It also takes into account environmental considerations that affect electrical and mechanical aspects. The group specification covers the majority of use cases for embedded wireless modules.