SAN DIEGO – IPC last week presented scores of awards to engineers who worked on industry standards over the past couple years at IPC Apex Expo here.

For leadership of the D-33AT Task Group that developed the IPC-6012C Certification and Training course, Don Dupriest, Lockheed Martin Missiles & Fire Control, received a Committee Leadership Award.

For contributions to the IPC-6012C Certification and Training course, Elizabeth Allison, NTS – Baltimore; Gary Ferrari, FTG Circuits; Renee Michalkiewicz, NTS – Baltimore; Debora Obitz, Microtek – East; and Jose Rios, i3 Electronics, earned a Distinguished Committee Service Award.
                                                                                                                               
For leadership of the 5-45 Subcommittee that developed IPC-7801, Reflow Oven Process Control Standard, Joseph Kane, BAE Systems Platform Solutions
and Linda Woody, Lockheed Martin Missile & Fire Control, earned a Committee Leadership Award.

For contributions to IPC-7801, MB Allen, KIC; Paul Austen, Electronic Controls Design; Frederick Beltran, L-3 Communications; Casimir Budzinski, Safari Circuits; Fred Dimock, BTU International; Scott Homan, IEC Electronics – Albuquerque; Robert Hornsblow, Datapaq; Ife Hsu, Intel; Marc Peo, Heller Industries; Sam Polk, Lockheed Martin Missiles & Fire Control; Doug Schueller, AbelConn; Jose Servin Olivares, Continental Temic; Geok Ang Tan, DSO National Laboratories, and Tomo Yoshikawa, Senju Comtek, earned a Distinguished Committee Service Award.

For leadership of the 1-14 DFX Standards Subcommittee that developed IPC-2231, Design for Excellence (DFX) Guideline during the Product Lifestyle, Karen McConnell, Northrop Grumman and Cheryl Tulkoff, DfR Solutions, earned a Committee Leadership Award.

For leadership of the 5-21K Task Group that developed IPC-SM-817A, General Requirements for Dielectric Surface Mounting Adhesives, Nate Grinvalds, Rockwell Collins, earned a Committee Leadership Award.

For significant contributions to IPC-SM-817, Bev Christian, BlackBerry, earned a Special Recognition Award. For contributions to IPC-SM-817A, David Adams, Rockwell Collins; Frederick Beltran, L-3 Communications; Lance Brack, Raytheon Missile Systems; Laura Cohen, Continental Automotive Systems; David Edwards, Henkel; Lionel Fullwood, WKK Distribution; Ife Hsu, Intel; Richard Iodice, Raytheon, and Bill Vuono, TriQuint Semiconductor, earned a Distinguished Committee Service Award.

For leadership of the 6-10C Task Group that developed IPC-TM-650 Method 2.6.26A, DC Current Induced Thermal Cycling Test, Randy Reed, Viasystems Group, earned a Committee Leadership Award.

For contributions to IPC-TM-650 Method 2.6.26A, Matthew Byrne, BAE Systems Platform Solutions; Bev Christian, BlackBerry; Vicka Hammill, Honeywell Air Transport Systems; Kevin Knadle, i3 Electronics, and Paul Reid and Jose Rios, i3 Electronics, earned a Distinguished Committee Service Award.

For leadership of the 5-22AS Task Group that developed J-STD-001FS, Space Applications Electronic Hardware Addendum to IPC-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, Kathy Johnston, Raytheon Missile Systems and Garry McGuire, NASA Marshall Space Flight Center, earned a Committee Leadership Award.

For significant contributions to J-STD-001FS, James Blanche, NASA Marshall Space Flight Center; Agnieszka Ozarowski, BAE Systems Platform Solutions, and Jonathon Vermillion, Ball Aerospace & Technologies, earned a Special Recognition Award. For their contributions to J-STD-001FS, Kirk Armstrong, Naval Air Warfare Center Weapons Division; Gustavo Arredondo, Para Tech Coating; Robert Cooke, NASA Johnson Space Center; Robert Fornefeld, L-3 Communications; Daniel Foster, Missile Defense Agency; Constantino Gonzalez, ACME Training & Consulting; Gaston Hidalgo, Samsung Telecommunications America; Shelley Holt, L-3 Communications; Robert Humphrey, NASA Goddard Space Flight Center; Joseph Kane, BAE Systems Platform Solutions; Sean Keating, Amphenol (UK); Leo Lambert, EPTAC; Gregg Owens, Space Exploration Technologies; Helena Pasquito, EPTAC; Pamela Petcosky, Lockheed Martin Mission Systems & Training; Patricia Scott, STI Electronics; Jose Servin Olivares, Continental Temic, and Zenaida Valianu, Celestica, earned a Distinguished Committee Service Award.

For leadership of the 2-30 Committee that developed IPC-T-50M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, Steven Bowles, Viasystems Group and Vicka Hammill, Honeywell Air Transport Systems, earned a Committee Leadership Award.

For contributions to IPC-T-50M, Matthew Byrne, BAE Systems Platform Solutions; Don Dupriest, Lockheed Martin Missiles & Fire Control; Gary Ferrari, FTG Circuits; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Louis Hart, Compunetics; Joseph Kane, BAE Systems Platform Solutions; Nick Koop, TTM Technologies; Karen McConnell, Northrop Grumman, and Steven Nolan, Lockheed Martin Mission Systems & Training, earned a Distinguished Committee Service Award.

For leadership of the 8-40 committee and 8-41 subcommittee that developed the 2015 IPC International Technology Roadmap for Electronic Interconnect, Jack Fisher, Interconnect Technology Analysis, earned a Committee Leadership Award.

For contributions to the 2015 IPC International Technology Roadmap for Electronic Interconnect, Mike Carano, OM Group Electronic Chemicals; Karen Carpenter, TechSearch International; Dennis Fritz, SAIC; Happy Holden, Holden Consulting; Rich Kraszewski, Plexus, and Raj Kumar, Viasystems North America, earned a Distinguished Committee Service Award.

For leadership of the D-33A Task Group that developed IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards, Mark Buechner, BAE Systems and Randy Reed, Viasystems Group, earned a Committee Leadership Award.

For contributions to IPC-6012D, Lance Auer, Raytheon Missile Systems; Matthew Byrne, BAE Systems Platform Solutions; Denise Chevalier, Amphenol Printed Circuits; Bill Dieffenbacker, BAE Systems Platform Solutions; Don Dupriest, Lockheed Martin Missiles & Fire Control; Gary Ferrari, FTG Circuits; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Vicka Hammill, Honeywell  Air Transport Systems; Nick Koop, TTM Technologies; Leo Lambert, EPTAC; Cliff Maddox, Boeing; Chris Mahanna, Robisan Laboratory; Jim Monarchio, TTM Technologies; Steve Nolan, Lockhead Martin Mission Systems & Training; Bill Ortloff, Raytheon, and Jose Rios, i3 Electronics, earned a Distinguished Committee Service Award.

For leadership of the 5-18g subcommittee that developed IPC-7092, Design and Assembly Process Implementation for Embedded Components, Raj Kumar, Viasystems North America and Vern Solberg, Solberg Technical Consulting, earned a Committee Leadership Award.

For contributions to IPC-7092, Hikmat Chammas, Honeywell Air Transport Systems, and Bruce Hughes, Amrdec MS&T EPPT, earned a Distinguished Committee Service Award.

For leadership of the D-13 Subcommittee in the development of IPC-FC-234A, Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards, Michael Beauchesne, Amphenol Printed Circuits, and Clark Webster, ALL Flex, earned a Committee Leadership Award.

For significant contributions to IPC-FC-234A, Terry Shepler, Electro-Materials, earned a Special Recognition Award.

For contributions to IPC-FC-234A, Scott Bowles, L-3 Fuzing and Ordnance Systems; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Thomas Gardeski, Gemini Sciences; John Leschisin, Minco Products; Steven Nolan, Lockheed Martin Mission Systems & Training, and Brent Sweitzer, Multek Flexible Circuits, earned a Distinguished Committee Service Award.

For leadership of the 5-23A Task Group that developed J-STD-003C Amendment 1, Solderability Tests for Printed Boards, Gerard O'Brien, Solderability Testing & Solutions, and Michah Pledger, Pledger Consulting, earned a Committee Leadership Award.

For contributions to J-STD-003C Amendment 1, Bev Christian, BlackBerry; David Sommervold, The Bergquist Company – Prescott; Henry Rekers, Schneider Electric; Jose Rios, i3 Electronics; Karl Sauter, Oracle America; Louis Hart, Compunetics, and Mahendra Gandhi, Northrop Grumman Aerospace Systems, earned a Distinguished Committee Service Award.

Awards were presented to individuals for significant contributions to IPC through committee service.