PHILADELPHIA – ACI Technology’s Annual Tech Fair will take place May 20-21 at its headquarters here.

The event is a hands-on expo of the latest printed circuit board assembly equipment.

MPM Speedline will provide an in-depth guide to best practices and troubleshooting techniques for stencil printing.

Nikon Metrology will show its X.Track technology, and CimQuest Manufacturing Solutions will discuss how 3D technology can manufacture a part directly from 3D CAD data.

Essemtec will show its new jet printer and Cubus automated component storage and retrieval system.

ACE Production Technologies will present new selective soldering systems and share soldering requirements of through-hole technology.

Dr. Bill Cardoso of Creative Electron will describe advances in x-ray and the software algorithms used at incoming inspection to screen for counterfeit and substandard parts.

Koh Young will share equipment and expertise driving toward the goal of 100% yield.

MEK will provide the latest advances in automated optical inspection.

Metrohm will present on ion chromatography and its application to electronic component investigation, along with spectroscopy and electrochemistry.

For more information or to register, contact Katie Riggan at 610-362-1295, or email registrar@aciusa.org.