LAS VEGAS – IPC Apex Expo requests technical posters to be displayed throughout the March event. Poster presentations are scheduled for Mar. 16.  

Submissions are sought in all areas of the electronics industry, including automation; adhesives; advanced technology; area array/flip chip/0201 metric; assembly and rework processes; BGA/CSP packaging; black pad and other defect issues; BTC/QFN/LGA components; business and supply chain issues; cleaning; conformal coatings; corrosion; counterfeit electronics; design; electromigration; electronics manufacturing services; embedded passive and active devices; environmental compliance; Lean six sigma; LED manufacturing; failure analysis; flexible circuitry; HDI technologies; head-on-pillow; board and component warpage; high-speed, high-frequency and signal Integrity; Pb-free fabrication, assembly and Reliability; miniaturization; nanotechnology; optoelectronics; packaging and components; PCB fabrication; PCB and component storage and handling performance; quality and reliability; photovoltaics; package-on-package; printed electronics; reshoring; RFID circuitry; robotics; soldering; surface finishes; test, inspection and AOI; tin whiskers; 2.5D/3D component packaging; underfills; via plugging and other protection, and wearables.

Abstracts of up to 300 words should summarize technical and previously unpublished work, covering case histories, research and discoveries.

Poster presenters are entitled to a free one-day conference pass for Mar. 16.

For more information, visit www.ipcapexexpo.org/html/present/call-for-participation.htm.