SAN JOSE -- Lutz Hofman of Fraunhofer ENAS won the annual IWLPC Best of Conference Paper, conference organizers said today.

The winning paper was “3D Wafer-Level Packaging by using Cu-Through Silicon Vias for Thin MEMS Accelerometer Packages.”

Best of Conference Presentation was awarded to Chet Palesko of Savansys Solutions for “Technology and Cost Comparison of Electronic Packaging Methods.”

Besides Hofman, track winners include Tom Strothmann of Kulicke & Soffa for "Methods for Assembly of TSV Products,” and Thomas Uhrmann of EV Group and Jose Campos of Nanium for their paper “Temporary Wafer Carrier Solutions for Thin FOWLP and eWLB-based PoP."

Winners are chosen by the technical committee from the respective technical tracks based on technical merit, relevance, originality, knowledge of subject, quality of material and quality of presentation.

IWLPC is an annual conference for wafer-level, 3D, TSV, and MEMS device packaging technologies.