HERNDON, VA – iNEMI has issued a call for participation for the High-Temperature, Pb-Free Die-Attach Material Project.

This project plans to assess the processability and reliability of different Pb-free materials available for power semiconductor die-attach applications on leadframe or ceramic substrates. Application targets include power MOSFET, IGBT modules, and integrated power modules.

Project leaders are Sze Pei Lim from Indium and Kinya Ichikawa from Intel.

Free call for participation webinars are scheduled for Apr. 14. The webinars will discuss the project objectives, scope and plan, as well as the sign-up steps.

To register for the webinar for Asia participants, visit https://inemi.webex.com/mw3000/mywebex/default.do?service=1&siteurl=inemi&nomenu=true&main_url=%2Fmc3000%2Fe.do%3Fsiteurl%3Dinemi%26AT%3DMI%26EventID%3D476276077%26UID%3D0%26Host%3DQUhTSwAAAAKbahIT5zn-jS8Y0GwnPG1c5yBuCdEiSjSBW_5O_hL5fBE3uRRrATZIMlG81Q_UXDu9IS_dd4Rgnrhs6uhsmNLX0%26RG%3D1%26FrameSet%3D2

To register for the webinar for North America and Europe participants, visit https://inemi.webex.com/mw3000/mywebex/default.do?service=1&siteurl=inemi&nomenu=true&main_url=%2Fmc3000%2Fe.do%3Fsiteurl%3Dinemi%26AT%3DMI%26EventID%3D476276387%26UID%3D0%26Host%3DQUhTSwAAAAIHPYCtJu3kVywvHf5Aq8sOUS8utYYva3VsEc9OmARdWTcMKDNuEDX-M2eNG3hVHDVD-09niz5yGz62U-RW3CPz0%26RG%3D1%26FrameSet%3D2

The project sign-up deadline is May 15.

For additional information, contact Masahiro Tsuriya at m.tsuriya@inemi.org.