SAN DIEGO – IPC requests abstracts for IPC Apex Expo 2017 to be held at the San Diego Convention Center Feb. 14-16.

Expert papers and presentations are sought on design, materials, assembly, processes, test, reliability and equipment in the following areas: 3D printing in electronics manufacturing; automation in electronics manufacturing; adhesives; advanced technology; area array/flip chip/0201 metric; assembly and rework processes; BGA/CSP packaging; black pad and other board-related defect issues; BTC/QFN/LGA components; business and supply chain issues; cleaning; conformal coatings; corrosion; counterfeit electronics; design; electromigration; electronics manufacturing services; embedded passive and active devices; environmental compliance; graphene in electronics manufacturing; Lean Six Sigma; LED manufacturing; failure analysis; flexible circuitry; HDI technologies; head-on-pillow; board and component warpage; high-speed, high-frequency and signal; Industry 4.0; integrity; lead-free fabrication, assembly and reliability; miniaturization nanotechnology optoelectronics; packaging and components; PCB fabrication; PCB and component storage and handling performance; quality and reliability; photovoltaics; PoP (package-on-package); printed electronics; reshoring; RFID circuitry; robotics; soldering; surface finishes; test, inspection and AOI; tin whiskers; 2.5D/3D component packaging; underfills; via plugging and other protection; and wearables.

Technical abstracts of 200 to 400 words should summarize original and previously unpublished work covering case histories, research and discoveries. Submissions should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain technical test results.

In addition, course proposals are solicited from individuals interested in presenting half-day or full-day professional development courses on design, lead-free technologies, manufacturing processes, process improvement, materials, test and reliability.

Technical abstracts are due June 17, and course proposals are due Aug. 5.

To submit an abstract or course proposal, visit www.IPCAPEXEXPO.org/CFP.

To recognize exceptional achievement, “Best Paper” awards will be presented.