SAN JOSE, CA  – Jabil has completed the first phase of qualification of Invensas' Bond-Via-Array (BVA) interconnect technology.

“BVA is a proven high-density, 3D interconnect technology for package-on-package (PoP) and system-in-package (SiP) applications,” said Craig Mitchell, president, Invensas. “As an established leader in the manufacture of a diverse array of electronic products, Jabil’s identification of BVA as the benchmark for fine pitch package stacking is yet another validation of the value this technology brings to the industry.”

Jabil aims to address customer requirements to mount fine pitch stacked packages to printed circuit boards with high yield and high throughput. To optimize the PCB assembly process of BVA-based packages for high-volume production and ensure a complete manufacturing ecosystem, Jabil will also collaborate with Fuji Machine Mfg. Co.

“Invensas BVA technology is a low-cost, versatile package stacking solution that is capable of scaling to very fine pitch,” said Dan Gamota, vice president of strategic capabilities, Jabil.

Invensas is a wholly owned subsidiary of Tessera Technologies.