DUBLIN – The market size of thermal interface materials is projected to reach $2.33 billion by 2021, a CAGR of 11.2% between 2016 and 2021, says Research and Markets.

Increasing demand from the consumer electronics industry is the major driver for the TIMs market, the firm says, in addition to the telecom industry. The computers segment was the largest application of TIMs in 2015.

TIMs are used in computers to optimize the performance and reliability for smooth functioning. TIMs are commonly used for transferring the thermal conductivity from the CPU or GPU to the heat sink coolers. TIMs are used for improving heat flow in computers by filling any voids or irregularities between the heat sink and SSE base plate mounting surfaces. The use of TIMs in computers is growing at a high rate because of the increased demand for cloud and supercomputing, says the firm.

Asia-Pacific is the largest market for TIMs globally, with China dominating the market in the region. Growth here is attributed to rapid economic expansion.

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