BANNOCKBURN, IL — Lars Bruno, Ericsson AB, won best technical conference paper of IPC Apex Expo for “Rework of New High Speed Press Fit Connectors.”

Two papers received honorable mentions: “Effect of Encapsulation Materials on Tensile Stress during Thermo-Mechanical Cycling of Pb-Free Solder Joints” by Maxim Serebreni, DfR Solutions, with co-authors Nathan Blattau, Ph.D., Gilad Sharon, Ph.D., and Craig Hillman, Ph.D., as well as “SIR Intercomparison to Validate the Use of a Fine Pitch Pattern” by Christopher Hunt, Gen3 Systems.

This paper was co-authored by Ling Zou, National Physical Laboratory.

Papers were voted on through a ballot process by members of the IPC Apex Expo Technical Program Committee. Awards will be presented during the opening keynote on Feb. 14.

Papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing, as well as value to the industry.