MINNEAPOLIS, MN – Mike Bixenman of Kyzen won the Best of Presentation award at the 2017 International Conference on Soldering and Reliability (ICSR) for his presentation “Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach.”

“I am most appreciative of the attendees at International Conference on Soldering and Reliability for selecting my presentation for the Best of Presentation award,” said Bixenman. “There were many good presentations and to be recognized by my peers is a true honor.”

This year ICSR included the physical design aspects relating to electronics component, product and system reliability, involving such topics as thermal and mechanical design, design for manufacturability, test and signal integrity.

The Best of Presentation award was determined through evaluations of attendees.


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