HERNDON, VA – iNEMI is hosting an Aug. 30 webinar on its Packaging and Component Substrates Roadmap. Bill Bottomsm, who chaired the committee that wrote the chapter, will lead the webinar.  

Emerging package types such as fan-in and fan-out wafer level packaging (WLP), 2.5D and 3D integration, system in package (SiP) and heterogeneous integration (HI) represent key innovations that need to be accelerated to maintain the pace of progress.

The free webinar will focus on where packaging technology is headed.

For more information, visit http://community.inemi.org/ev_calendar_day.asp?date=9/13/2017&eventid=147&utm_campaign=2017%20Roadmap&utm_source=hs_automation&utm_medium=email&utm_content=55438649&_hsenc=p2ANqtz--i75fDcVGaQ3MWiLI_imW2mvhu49CrYFAMSswbZX0S6_14EvbUJClZwSE86zvAjprcnqwp-p2-uCjNbfs2o-Id2NjZ6Q&_hsmi=55438649.

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