BANNOCKBURN, IL – IPC’s 5-31j Cleaning Compatibility Task Group introduced IPC-9505, Guideline Methodology for Assessing Component and Cleaning Materials Compatibility, an alternative to Mil-Std-202, Method 215.

The guideline provides methods and procedures for component compatibility analysis relevant to current electronic assembly processes. IPC-9505 establishes uniform methods for testing electronic and electrical components, including static and dynamic cleaning exposure tests, to determine resistance to deleterious effects from exposure to the cleaning agent and mechanics used to deliver the cleaning agent to the part.

“IPC-9505 is the result of a need to replace the Mil-Std-202 Method 215,” said Eddie Hofer, Rockwell Collins, chair of the 5-31j Cleaning Compatibility Task Group. “The main issue with Mil-Std-202 is that chemicals used in current electronic assembly processes are not represented in the document, and new test methods were needed to address new chemistries and processes.”

IPC-9505 addresses material compatibility risks when cleaning electronic hardware, including issues relating to PCB laminates, surface finishes, components, metal alloys, adhesive bond strength, part markings, plastics, the mix and configuration of materials in the assembly and impact of entrapped contaminants.

Other factors considered are the chemical characteristics of the cleaning material, cleaning temperature, mechanical impingement energy, and exposure time to the cleaning process, including rework cycles.

“Committee 5-31j encourages the industry to review and utilize the methods outlined in IPC-9505. Please reach out to the working group to help us maintain IPC-9505’s alignment with industry needs.”