MINNEAPOLIS - The SMTA seeks papers for its November International Wafer-Level Packaging Congress and Exhibition.The event takes place Nov. 3-4 in San Jose.
 
Called the IWLPC, the event focuses on leading-edge IC packaging and test technologies with  special emphasis on 3D stacked packaging.

Abstracts of 200 words should be submitted by April 1 to smta.org/iwlpc/call_for_papers.cfm or by email to Kristin Nafstad (kristin@smta.org).

 

 

The event is also sponsored by Chip Scale Review.