FRANKLIN, MA - SMT manufacturing experts from Speedline Technologies will address the issues involved in "Lead-Free Reflow Soldering Power And Nitrogen Consumption" during a free, live, Web seminar on May 19 from 11 a.m. to 12 noon, ET. 

Selecting a reflow oven for an SMT manufacturing process requires numerous engineering considerations, including board size capacity, heating zones, nitrogen compatibility and the ability to maintain even heat.  With the introduction of lead-free materials, new and more complicated factors are compounding the decision. 

With the introduction of lead-free requirements, process engineers must now also consider the ability to achieve the heat required to reflow the lead-free solder paste and to cool the soldered joints at a rate that will provide the best possible product quality. In a lead-free process, two "cost of ownership" issues now gain additional significance: energy consumption and nitrogen consumption. The seminar will discuss an analysis of energy and nitrogen consumption in lead-free reflow soldering equipment. 

Topics will include: a comparison of energy consumption in new reflow oven designs versus previous reflow oven designs; an actual power consumption case study of lead-free versus tin lead process; and methods for controlling nitrogen consumption.

For more information or to register, visit speedlinetech.com/seminars.