Munich, Germany and Westford, MA -- Zuken was chosen as the EDA vendor representative to participate in a multinational research project that came to a close in May. Zuken was selected for its knowledge in EMC (electromagnetic compatibility) simulation and modeling.

The aim of the MESDIE (microelectronic EMC system design for high density interconnect and high frequency environments) project was to research modeling for new chip sets, dedicated HDI and package modules for applications facing EMC/noise and system integration in the telecommunications, automotive, consumer and multimedia sectors.

MEDEA, the industry-initiated pan-European program for co-operative R&D in microelectronics, headed up the three-year, multinational MESDIE project. Working with companies such as Airbus, Alcatel, Bosch, Infineon, Continental, Philips and ST-Microelectronics, the project has begun forming the basis of methods of modeling and simulation at the system design level. 

Zuken helped advance technology concepts for EMC-related modeling of power ground systems for various off-chips structures, at both the HDI and board level.