Teddington, UK – The National Physical Laboratory is hosting a two-day Master Class on Solder Joint Reliability on Oct. 12-13.  Industry expert Werner Engelmaier, known as “Mr. Reliability,” will lead the class.

The class will be split into four half-day sessions: 1) Fundamentals in Solder Joint Reliability, 2) Failure Mode and Root Cause Analysis (Fatigue, Brittle Fracture, ENIG) & Acceleration Models, Reliability Tests and Screening Procedures, 3) Reliability Issues for Lead-Free Soldering, 4) Interconnect Failures and Design for Reliability for Plated-Through Holes/Vias, including Lead-Free Solder Impact.

Engelmaier’s background enables him to address the issues underlying electronic packaging from a system’s point-of-view, dealing with synergistic interdependence of material behaviour, processing aspects, thermal design, functional and environmental requirements.

He established the Product Reliability Main Committee of the IPC and has been Chairman since its inception. Author of over 150 technical publications, he holds two patents.

For more info: www.npl.co.uk/ei/news/