BERG, SWITZERLAND – Alphasem AG has sold its 250th Swissline die attach machine in North America, the company said today.

The second-generation machine for die attach and sort processes was introduced in 2001.

Alphasem is a supplier of packaging equipment to Intel, Infineon, Micron, IBM, Amkor and Texas Instruments.

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
Don't have an account yet? Register Now!

Sign in to your account