ENDICOTT, NY -- Endicott Interconnect Technologies, IBM's former manufacturing arm, has teamed with Universal Instruments Corp. to automate and maximize production of very large, complex printed circuit cards and assemblies.

Endicott Interconnect, which builds PCBs, assemblies and chip packages, is using Universal's Advantis Flip Chip placement system and Polaris multi-process assembly machines to fully automate production of a high-performance chip carrier for a leading military supplier.

The product has several hundred surface-mount components, several memory devices and a very large heat spreader, Endicott Interconnect said in a press statement.

"Due to the mission critical nature of the product, we require stringent accuracy along with the ability to gang pick- and-place the larger components and sophisticated parts tracking," said Raj Raj, Endicott Interconnect senior engineering manager. "In partnership with Universal, we are able to achieve an advanced and innovative solution for these unique manufacturing needs."