MINNEAPOLIS -- The annual Pan Pacific Microelectronics Symposium & Exhibit will focus on lead-free PWB finishes, 3-D integration, lead-free package finishes and advanced flip chips.

The dual keynotes are, Prospects and Challenges of Nano-Packaging for Electronic and Bioelectronic Systems, will be given by Rao Tummala, Ph.D., of the Georgia Institute of Technology, and Summary of New England Lead-free Consortium Implementation Plan of High Volume Assembly of Printed Wiring Boards, by Sammy Shina, Ph.D., of the University of Massachusetts Lowell.

The event takes place Jan. 17-19, in Hawaii and is sponsored by the SMTA.

Other sessions will cover thermo-mechanical reliability, materials deposition, MEMS and sensor networks, and embedded and SiP packaging, materials and process management and reliability testing and failure analysis.

Sponsors include 3M Co., Asymtek, Dow Corning, Indium, Libra Industries and Sonoscan.

For details visit smta.org/pan_pac.