IPC Publishes ’04-’05 Roadmap
Published: 12 December 2005
by Staff
BANNOCKBURN, IL – IPC has released its 2004-2005 International Technology Roadmap for Electronic Connections. This version of the roadmap features more input from Asia and Europe than in previous years, and is split into two volumes.
The roadmap provides direction for product and process development for companies building electronic and optoelectronic equipment. Each chapter contains specific recommendations addressing current, near-term, mid-term and long-term requirements, proposed actions and opportunities.
“IPC’s roadmap is one of four international roadmaps, but is the only one of the four that specifically focuses on the processes that make up a PCB manufacturing plant or component assembly operation,” said Dieter Bergman, IPC’s director of technology transfer. “The current version has two significant enhancements from the previous versions. The first is significantly increased international participation from Europe and Asia; and the second is the segmentation of the roadmap into two volumes for easier reading and searching.”
The roadmap is free to members (download at ipc.org), and can be purchased by non-members for $250.
For more info on the 2004-2005 roadmap or the 2006-2007 version, contact Dieter Bergman (DieterBergman@ipc.org) or Jack Fisher, Interconnect Technology Analysis, (fish5er@mindspring.com).
