Austin, TX, Dec. 3 -- A new study by TechSearch International projects a compound growth rate of over 28% in the flip chip and wafer level packaging market between 2004 and 2009. With a forecasted demand of 22 million 8-in. equivalent wafers (FC and WLP) in 2007, TechSearch projects a need for capacity expansion to meet the requirements.

 

According to the study, the drivers for flip chip continue to be performance, on-chip power distribution, pad limited designs and form factor requirements. High-performance logic suppliers such as ASIC, FPGA, DSPs, chipset, graphics and microprocessor makers are expanding their use of flip chip in package (FCIP). Applications such as watch modules and automotive electronics are included as flip chip on board (FCOB) packaging solutions.  An increasing number of devices, from diodes to DRAMs, are packaged at the wafer level. 

 

WLPs are also growing in volume for a variety of low lead count (¾100 I/O) applications-including analog devices such as power amplifiers, battery management devices, controllers, memory and integrated passives. Most of these devices are relatively small in size, and thousands can be fabricated on a single wafer.  While the shift to flip chip and WLP did not materalize in high volume for DDR2 DRAM, performance requirements will necessitate a shift in interconnect methods from wire bond to bumps (flip chip or wafer-level package) for DDR3. Gold bump demand continues to be dominated by LCD driver ICs, but an increasing number of gold stud bumped devices are also shipping.

 

The expansion of flip chip technology continues to spark innovation and new developments. New bumping technologies continue to be introduced for the flip chip market. The assembly of bumped silicon fabricated with low-k dielectric materials resulted in a host of issues requiring changes to the materials and the assembly process.

 

Legislation in Europe banning lead and other materials deemed harmful to the environment by 2006 currently provides an exemption for high-lead flip chip bumps, however a number of companies are moving to adopt lead-free bump compositions.  Demand for 300 mm bumping is expected to expand with increased production of devices on 300 mm wafers. Solder bumping prices continue to decline and are no longer a factor in the adoption of flip chip. However, high substrate prices continue to be a barrier to widespread migration from wirebond to flip chip attachment.