Endicott, NY --  Endicott Interconnect Technology was recently issued a patent to improve package reliability, its second since the company's formation in 2002.

In late October, EI received their first U.S. Patent (6,809,269) "Circuitized Substrate Assembly and Method of Making Same" - a multilayer printed circuit that uses conductive paste to form electrical connections between layers of the structure. 

This was followed by the U.S. patent issued this week (6,815,837), "Electronic Package with Strengthened Conductive Pad" - an approach to strengthening the design of printed circuits to improve their reliability when assembled with components.