"This is an important business development for Reptron that increases our capacity to provide manufacturing services for the communications industry sector," said Bonnie Fena, president of Reptron Manufacturing Services.
Full production is expected to ramp by the end of 2004.
Under the deal, Reptron will build 150 different subassemblies and PCBs for wired and wireless intercommunications products. Much of the current phase involves converting from plated through-hole to to surface mount technology.