The Surface Mount Technology Association (SMTA, Minneapolis, MN) has announced the program for the International Wafer Level Packaging Congress on Oct. 10-12 in San Jose, CA. The program is now available live on the SMTA Web site.

The exhibition will track leading-edge IC packaging and test technologies with special emphasis on 3-D stacked packaging. It includes a three-day technical program and two days of exhibits presented by leading suppliers to the semiconductor packaging and testing industry.

Full details on the courses, technical sessions and special events can be found at: http://www.smta.org/iwlpc/.

Copyright 2004, UP Media Group. All rights reserved.