Recognizing the challenges facing electronics assemblers as they convert to lead-free processes, Cookson Electronics Assembly Materials (Jersey City, NJ) is launching the CE Analytics Lead-Free Process Capability Validation Program.

The program consists of two elements: a test kit containing Cookson's laminates, pad finishes, stencils, lead-free solder paste and cored wire combined with boards, lead-free components and set up software from Practical Components. The second element is a lead-free process capability report based on CE Analytics' analytical evaluation and process capability validation services conducted on finished assemblies tested to IPC and J-STD requirements. 

"We spoke with customers who were concerned about the time and cost associated with successfully transitioning to lead-free," said Tom Hunsinger, Cookson Electronics' product manager. "Their main concerns were reliably validating their lead-free process, and having a single source that offered all of the required materials and analytical services.  They wanted to make one call to get the complete package."

The kit contains the consumable materials needed to set up and run a lead-free surface-mount process. The test boards are then built and sent to CE Analytics where lead-free process capability assessment services are conducted. The output is a detailed laboratory analysis report with recommendations for process optimization.

Cookson Electronics Assembly Materials, a Cookson Electronics company, manufactures materials used in electronic assembly processes. CE Analytics is Cookson's resource for diagnostics solutions, analytical services and applications expertise. 

www.cooksonelectronics.com/no-lead

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