Viscom Presents 3-D Paste Inspection
Early recognition of errors is becoming increasingly important when inspecting assemblies. In addition to proven 2-D evaluation for offset, completeness and smearing, Viscom (Norcross, GA) now presents 3-D paste inspection as an auxiliary option for the familiar S3054QS QuickScan Inspection System. The 3-D option can be used particularly for critical components such as ball grid arrays (BGAs) and flip chips.
The inspection system is distinguished by it short programming times and high-speed error recognition for flexible production. The simple programming allows set-up operations for different products to be accomplished within a short time.
Beginning immediately, 3-D inspection is available for checking paste printing. For this application, Viscom implemented a light section method using a dual-line laser illumination to allow image recording. With the aid of this new, modular 3-D height sensor, a height resolution of 10mm is possible.
In addition to the error characteristics of missing paste, smearing and short circuits, the height of the past print, the volume and the topography can be measured and evaluated.
The 3-D option fits in the company's existing automatic optical instpection environment and is compatible with all known tools and auxiliary tools.
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