Circuits Assembly Online Magazine - Endicott Interconnect Technologies Announces $10 Million Capital Expansion

Endicott Interconnect Technologies (Endicott, NY) has announced a $10 million capital expansion program to meet demand in all of its products, especially in the defense and aerospace markets. Much of the funding will be spent on equipment that will enter production during the second half of this year.

"Endicott Interconnect's printed circuit board (PCB), semiconductor packaging and complex electronic assembly business are all experiencing strong growth, and this additional expansion will position us to meet our customers' demands this year," said Jim Herard, marketing manager.

The capital package includes monies for equipment to produce PCBs greater than 28 in. long and additional lamination capacity for high performance materials. Other capacity increases for semiconductor packaging production and printed wiring board production are also included.

Also included in the package were funds for expansion and equipment for the production of complex electronic assemblies that will enter volume production later this year and additional funding for expansion in the precision machining area to be used for production of the SureScan explosive detection system announced previously by Endicott Interconnect.

Endicott Interconnect Technologies Announces $10 Million Capital Expansion

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