The Surface Mount Technology Association (SMTA, Minneapolis, MN) is again co-locating its annual conference, SMTA International, with the Assembly Tech Expo (ATExpo) show this fall at the in Rosemont, IL, on Sept. 26-20.

As emerging technologies help to stimulate the recovering economy, the SMTA has once again organized an Emerging Technologies Summit to address the latest trends in electronics manufacturing and assembly. The summit will consist of three paper sessions and a concluding  panel discussion.

The first session, MEMS Technology Trends and Reliability, will feature papers on Qualification and Reliability for MEMS and IC Packages; Hybrid RF MEMS Circuit Packaging; and Methodology for Prognosis of Electronics and MEMS Packaging.

The next session, Emerging IC and 3-D Packaging, will feature papers on Camera Module Packaging Technology; Sub 100nm Silicon - The Impact of Next Generation IC Packaging; and Development of 3D-Redistribution and Balling Technologies for Fabrication of Vertical Power Devices.

The last session, New Materials and Processes, will feature papers on Injection-Molded Packages; Joining Technology with Low Melting Solders and Heat Resistant Adhesives; Jet Dispensing Underfills for Stacked Die Applications; and Low Cost Air Cavity Liquid Crystal Polymer (LCP) Packaging.

Moderated by Steve Greathouse of Intel Corp., the panel discussion will feature key industry participants who will respond to audience and moderator questions.

http://www.smta.org/smtai/symposium.cfm

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