Nu Visions Purchases Juki’s High Speed Placement Line
Nu Visions Manufacturing LLC (Springfield, MA), a provider of electronics manufacturing in the Northeast, has increased production capacity for producing printed circuit boards (PCB). Responding to increased demand for populated PC board products, Nu Visions purchased four additional lines of Juki Automation pick-and-place machines in late 2003. Recently, Nu Visions added another high-speed placement line composed of Juki's KE-2060 and the new FX-1 machines for a total of 19 machines configured in eight lines. Nu Visions is the first manufacturer in the Americas to purchase the new FX-1 model.
Nu Visions specializes in low-volume, medium-to-high mix PCB manufacturing, partnering with customers from product design and concept through volume manufacturing. Purchasing Juki's equipment allowed Nu Visions to retrofit existing lines with updated trolley feeders that increase the speed of feeding parts.
The new KE-2060 is a hybrid machine, combining a high-speed chip shooter that places a wide range of components at 12,500 CPH with a fine-pitch placement machine that places 1,850 fine-pitch components per hour. It is quickly programmable and has a dual component recognition system with both vision and laser technology.
The FX-1 is a high-speed placement machine capable of 25,000 components per hour. The design structure of a dual head on a single x beam design contributes to the overall placement speed of this machine; one head picks components while the other head places them.
Nu Visions aims to provide small company flexibility and responsiveness with large company technical depth and manufacturing capabilities. Its growth during the last four years has been largely due to their ability to provide better service and offer strong surface-mount technology assembly capabilities. Some of these capabilities include: single and double-sided component populated assemblies, selective wave soldering, placing fine-pitch quad flat packs (QFPs) and connectors, plastic, tape, and ceramic ball grid arrays (BGAs), micro BGAs, high pin count interconnects, and high I/O BGAs.
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