U.S. Jury Finds Hon Hai Industries Liable for BGA Patent Infringement
FCI (Etters, PA), a manufacturer of connectors and interconnect systems, has won a substantial victory in its patent infringement suit involving FCI's ball grid array (BGA) connector technology brought in the U.S. against Hon Hai Precision Industries (Foxconn, Tucheng, Taiwain).
On Feb. 13, after a two-week trial in San Francisco, CA, a jury returned a verdict finding Hon Hai liable for infringement of two FCI patents relating to its BGA connector technology.
The jury also found the infringement to be willful and that Hon Hai is liable for multi-million dollar damages as a result of its infringement of FCI's patents.
The infringing sockets are used in computer notebooks, desktops and servers that use BGA socket technology.
Jean Lucien Lamy, FCI chairman and chief executive officer, said, "We will continue, in this instance and in any other cases that should arise, to pursue all legal means to protect our intellectual property."
BGA patented technology from FCI is currently licensed worldwide to Tyco and Molex for socket applications.
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