Indium Offers Fluxes for Flip Chip Soldering
Indium Corp. (Utica, NY) has introduced PK-001 and PK-002 flip chip epoxy fluxes designed for use with Sn62 and Sn 63 eutectic solders. The fast curing, halide-free, no-clean fluxes can be used for flip chip or chip-scale package (CSP) soldering processes.
The fluxes have a stable thermoset residue, compatible with standard underfill materials, conformal coatings and most finishes and coatings. They are also environmentally friendly.
Many effective methods can be used to apply the fluxes, such as pin transfer, stencil printing, dispensing or dipping techniques.
Contact Indium Corp. to obtain a copy of the product data sheets.
Indium Corporation is a supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, lead-free solder alloys, underfill materials and die-attach materials.
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