PCB Design Conference East Issues Call for Abstracts
Published: 02 January 2007
by Staff
The five-day conference program focuses on PCB design, engineering and manufacturing. The conference is comprised of a three-day technical conference and a Professional Development Certificate program of one-day and two-day courses. PCB East 2007 also includes a two-day (Oct. 23-24) exhibition of top industry vendors.
Papers and presentations of the following durations are sought for the technical conference: 30-minute paper sessions, one-hour lectures or panel sessions, two-hour workshops, and half-day (3.5 hour) seminars. Papers and presentations also are sought for a Professional Development Certificate program of in-depth, one-day and two-day technical tutorials.
Suggested presentation topics include: high speed, high frequency and signal integrity; component placement; EMI/EMC analysis; thermal analysis; lead-free processes; RF and microwave design; packaging design; mixed-signal design; area arrays; FPGA design and implementation; embedded passives and active devices; flexible circuitry; HDI design and technologies; PCB design/layout basics; component library creation and management; design for manufacture, test and assembly; design (including analog, digital and power supplies); PCB fabrication; soldering; surface finishes; industry forecasts, and business and design/supply chain issues.
For consideration, please email course title, suggested course length, short description of the target audience, 100- to 300-word abstract and speaker bio(s) to Kathy Nargi-Toth (knargitoth@upmediagroup.com) by Feb. 5.
Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodology rather than on a company’s specific products.
If selected, final papers and presentations will be due in April.
