Topics to be covered include SnPb with lead-free components; reliability; harsh environment; tin whiskers; new alloys; electromigration; thermal dissipation; manufacturing process; supply chain issues; advanced packaging; new substrate materials; surface finishes; thermal interface materials, and underfill.

To present, please submit a 200- to 300-word abstract to Melissa Serres at melissa@smta.org by Jan. 31. Include title, author’s name and contact information. Technical papers are optional, but PowerPoint presentations are required and due March 23.