SAN JOSE – A call for papers has been issued for the International Wafer-Level Packaging Conference scheduled for Sept. 17-19, in San Jose.  The conference program will include workshops, and business and technical sessions on wafer-level packaging, 3D/stacked packaging and test. The organizers seek 200-word abstracts with proposed topics. Abstracts should be submitted before Apr. 10 to Melissa Serres at melissa@smta.org.  Full details may be found at http://www.smta.org/iwlpc.