SANTA CLARA, CA – Intel Corp. today announced its future processors will be completely lead-free, beginning with its 45 nm high-k metal gate processors in the second half of this year, including Core 2 Duo, Core 2 Quad and Xeon processors.

To replace the remaining 5% of lead solder historically found in the first-level interconnect in processor packages, Intel will use a SnAgCu alloy. The company did not specify the brand or composition.
 
In 2008, the company’s 65nm chipset products will go lead-free.
 
Intel began producing lead-free chips in 2002, starting with its flash memory products. In 2004, the company began shipping products with 95% less lead than previous microprocessor and chipset packages.
 
Earlier this year, the company transitioned its StrataFlash Cellular Memory packages to halogen-free technology. The company is also evaluating the use of halogen-free flame-retardants in its CPU package technologies.