FRANKLIN, MA – On Oct. 18, Speedline will present a free Webcast on upstream solder joint defect inspection and the transition from “quality through inspection” to “quality through design,” with a concentration on the printing process. 

The one-hour presentation will begin at 11 a.m. EST. 

Specific areas of discussion will include an overview of the printing process; different inspection techniques; the effects of components and paste types on defects, and a review of experimental research currently underway. The ultimate goal is to predict the likelihood of solder joint defects before they occur, and to adjust design and processes to limit their occurrence.

To register, visit www.speedlinetech.com/seminars.