SAN JOSE, CA – The MicroElectronics Packaging and Test Engineering Council has finalized its program for the 2nd Annual Medical Electronics symposium: Growth Opportunities for Medical MicroElectronics. It will be held at Arizona State University in Tempe, AZ on Sept. 25.

The event will begin with a keynote presentation by Celeste Null, director of biomedical engineering in the Digital Health Group at Intel Corp.: The Future of Biotechnology.

Presentations in the areas of bioscience and medical technologies with a focus on the opportunities for microelectronics packaging will include: Business and Technology Overview; Medical Microelectronic Implants; Virtually Assisted Surgical Training: Concepts, Foundations, and Sensor-based Techniques; Emergence of Bio MEMS for Sensors and Bio-Telemetry; Packaging Medical Electronics; Implantable Monitoring -  Packaging Reveal XT and Next-Generation Injectable Monitors; IMEC - Novel "Chip-in-a-wire" Embedding Technology for Realizing Flexible Electrode Arrays for Medical Applications; Advanced Simulation of Medical Electronic Devices and Applications; Enabling Technologies; High-Density Interconnect Flexible Substrates in Medical Applications; Enabling MEMS Devices for the Medical Market; The Evolution of Telemedicine 2.0; Medical Electronic Product Applications; CMOS X-ray Detector Design and Performance and Application in Digital Mammography; Palm-Size Breath Analyzer for the Detection and Monitoring of Metabolic States, and Advancements in Hospital Technology.

To register, contact Bette Cooper, bcooper@meptec.org or visit www.meptec.org.