SAN JOSE – The MicroElectronics Packaging and Test Engineering Council announced its technical symposium Substrates: The Foundation of Semiconductor Packaging, to be held in San Jose Nov. 8.

The objective of this symposium is to identify technology requirements for the next generation of substrate technology, highlighting required innovations that will further enable IC component integration, and electronic system functionality.

The program is segmented into the following areas: Substrate Manufacturing and 1st Level Interconnect Technology; Design and Simulation: Silicon, Substrate, System; 2nd Level Interconnect and Reliability, and Emerging Substrate Technologies.

For more information, visit www.meptec.org.