NPL Issues Relative Reliability Measurement Report
Published: 16 October 2007
by Staff
TEDDINGTON, UK – A report describing a new combinational test method for measuring relative reliability of electrically conductive adhesive joints on subtractive thermoplastic substrates was just released by the National Physical Laboratory.
Thermoplastic substrates are suitable for processing using existing PCB fabrication infrastructure, NPL says. The combination of thermal cycling followed by damp heat conditioning has been found to develop high resistance failures in conductive adhesive joints significantly earlier than either damp heat testing or thermal cycling alone, according to the report, Relative Reliability Measurements for Electrically Conductive Adhesive Joints on Subtractive Thermoplastic Substrates.
The method described permits rapid relative reliability testing of comparable electrically conductive isotropic adhesives to determine the best material for use in a lead-free assembly with high recycling levels.
For a copy of the report, contact ling.zou@npl.co.uk.
