iNEMI to Kick Off 2007 Roadmap in Feb.
Published: 19 January 2006
by Staff
HERNDON, VA— The International Electronics Manufacturing Initiative (iNEMI) will kick off its 2007 Roadmap during Apex next month, with a meeting on Feb. 6-7. In addition, several iNEMI project activities and results will be discussed in conference forums and technical sessions.
Every two years, iNEMI maps the future manufacturing technology needs of the global electronics industry. The roadmap helps companies anticipate shifts in product requirements and provides an early warning of changes in technology or infrastructure. It also identifies emerging and disruptive technologies, fuels development of future projects and sets priorities for industry R&D over the next 10 years.
iNEMI is recruiting industry experts to participate in the 2007 Roadmap (membership is not required). The group is looking for a diverse mix of OEMs, EMS providers, suppliers and R&D institutes, including those in Europe and Asia.
For more details and a registration form, visit: inemi.org/cms/calendar/APEX_2006_Roadmap_2007_Mtg.html
Other iNEMI Meetings & Presentations
A Halogen-Free Call for Participation Meeting will take place on Feb. 8 at Disney’s Paradise Pier Hotel. This is an organizational meeting for iNEMI’s new halogen-free effort. The initiative hopes to promote standards development by establishing materials, manufacturing, assembly and test guidelines for halogen-free PWBs based on market segment requirements and technical, commercial and functional viability.
Other meetings on Feb. 8 will cover Lead-Free and RoHS; tin whiskers; and roadmapping interconnect technology. Session of Feb. 9 include: copper vs. optoelectronics in PCBs; the medical standards initiative; industry adoption of IPC 2581; and the Pb-Free DPMO project.
A Halogen-Free Call for Participation Meeting will take place on Feb. 8 at Disney’s Paradise Pier Hotel. This is an organizational meeting for iNEMI’s new halogen-free effort. The initiative hopes to promote standards development by establishing materials, manufacturing, assembly and test guidelines for halogen-free PWBs based on market segment requirements and technical, commercial and functional viability.
Other meetings on Feb. 8 will cover Lead-Free and RoHS; tin whiskers; and roadmapping interconnect technology. Session of Feb. 9 include: copper vs. optoelectronics in PCBs; the medical standards initiative; industry adoption of IPC 2581; and the Pb-Free DPMO project.
