Clinton, NY – Assembly materials supplier Indium Corp. offers an Electronics Assembly Reliability Program to meet the performance challenges facing electronics assemblers. The program combines products, service and technologies to optimize finished goods reliability.
 
Products featured in the reliability program include:
Indium5.1 Pb-Free, No-Clean Solder Paste -Addresses via-in-pad voiding, CSP printing for SMT Reliability.
Wave Solder Products (WF7742, PIP+ Preforms) -Addresses incomplete barrel fill with Pb-Free alloys for PTH Reliability.
No-Flow Underfills (NF220, NF260) -Addresses joint cracking due to brittle Pb-Free alloys and reduced-size joints for CSP Reliability.
Thermal Interface Materials (solder TIM) -Addresses thermal performance issues caused by increased power and reduced component size for Thermal Reliability. 
 
The program also offers customers new process and application concepts as well as the industry’s largest SMTA-certified engineering staff, an online interactive technology knowledgebase and online Pb-free readiness assessment software.
 
For more info, visit indium.com/reliability .