Tuesday's Blog: Don’t Forget Thermal Profiles for Adhesives
Published: 07 March 2006
by Mike Buetow
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ATLANTA --
In his blog today, Dr. Brian Toleno of
Henkel
reminds users to profile adhesives and underfills as they would solder pastes.
Click here to read:
http://circuitsassembly.com/blog/?p=16
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