Teddington, UK -- David Hillman and Doug Pauls will present a class on “Crafting a Lead-Free Solder Process” at the National Physical Laboratory on June 21. The course covers the necessary elements to develop a robust, high-reliability, Pb-free manufacturing process. 
 
Hillman is a metallurgical engineer in the Advanced Operations Engineering Department of Rockwell Collins. Pauls is a principal materials and process engineer, working on troubleshooting current manufacturing process and development of new materials and processes. 
 
Topics will include: the metallurgy of Pb-free; finish on boards and components; effects on organic materials from higher reflow temperatures – laminates, solder masks, adhesives, fluxes, process aids; assembly equipment considerations; cleaning of Pb-free residues; testing for residues; reliability testing and case studies; process characterization and qualification; environmental waste stream considerations.
 
To sign up for the course, contact Roger Hughes, Roger.Hughes@npl.co.uk.