OTTOBURN, GERMANY -- Siemens Automation and Drives has acquired the die bonder activities of F&K Delvotec Bondtechnik GmbH. No financial terms were disclosed.

Siemens will integrate the business with its Electronics Assembly Systems division, which includes its Siplace placement machines.

The companies suggested that they would look at ways to integrate placement and die bonding processes.
In a statement, Tilo Brandis: “The team at F&K Delvotec has deep-reaching knowledge in the die bonding field, where extreme precision is of the essence. Pairing this knowledge with the Siplace team’s experience in high-performance SMT processing provides a perfect combination."

Dr. Farhad Farassat, president of F&K Delvotec: “The electronics manufacturing market is moving toward integrated solutions where placement machines and die bonding functions form a unit. Siemens and F&K Delvotec can now supply these increasingly requested solutions from a single source.”

F&K Delvotec makes die and wire bonders and bond test and inspection systems available for semiconductors and several other applications.