HUDSON, NH – CeTaQ Americas has thrown its name into the ring of companies performing analysis of lead-free line capability.

Unlike programs that assess end-product compliance, however, CeTaq conducts machine capability analysis testing designed to ensure that production equipment is performing to spec.

In a press release, Michael Sivigny, general manager of CeTaQ Americas, said, “Lead-free solders don’t wet as readily as traditional tin/lead solders; thus, printing and placement accuracy is more important. In an instance where SMT pads are not accurately printed, such as partly printed onto a non-solderable area, or mask, it is likely in some cases that the solder will not wet the entire pad. Similarly, a lower surface tension in the liquidous solder may inhibit the ‘auto-centering’ effect that assemblers always counted on to center slightly offset components with tin/lead solders. Thus, placement accuracy is more critical than before. Keeping the lead-free process window as wide as possible requires, at the least, that assembly equipment operate optimally at its original performance specification. This keeps the process in control and helps ensure minimal defect levels and maximum yields.”

Recently, CeTaQ Americas announced the availability of a new service that verifies feeder and shuttle motion repeatability. This service was developed, Sivigny says, because one of the consequences of the move to lead-free assembly is less tolerance for even slight variations in placement accuracy. Components do not self-center as easily during reflow with lead-free solders. CeTaQ’s feeder calibration helps ensure repeatability of pick location, feeder indexing, component location and sprocket repeatability.