Pb-Free Boosts Cleaning Equipment Market
Published: 21 June 2006
by Staff
"Lead-free manufacturing has caused process changes in the SMT line that have placed more emphasis on cleaning," notes F&S industry manager Keith Robinson. "With more residue left on the assembly during lead- free manufacturing, industries that did not historically clean are likely to do so between 2006 and 2010, thus creating new market opportunities."
Pb-free manufacturing requires higher preheating and heating temperatures, causing changes in the flux that make it more difficult to clean. It also calls for an increased amount of flux, which leads to more residues on the assembly. Defects can occur in products if the assembly is not thoroughly cleaned, thus creating increased demand for SMT cleaning equipment.
Pb-free assemblies more difficult to clean, causing concerns among electronic assemblers about the feasibility of becoming Pb-free compliant in 2006. Moreover, cleaning Pb-free materials is highly demanding and places increased stress on the entire cleaning process.
"Some companies have been very proactive in educating customers on how to clean lead-free assemblies effectively," says Robinson. "SMT vendors will need to be very aggressive in addressing customers' needs in 2006, because this is a critical year for the SMT cleaning equipment market."
Apart from electronics manufacturing, the medical device, aerospace and defense industries are likely to increase their demand for SMT cleaning equipment. F&S predicts that these industries will be the primary markets for SMT cleaning equipment in North America and Western Europe. In China, the expanding space program is likely to provide new opportunities to equipment vendors.
