Dr. Lee was named SMTA Member of Distinction in 2002, received the Soldertec Global Lead-Free Solder Award in 2003 and recently received the 2006 CPMT Exceptional Technical Achievement Award. He has also served as an SMTA board member, liaison to the Taiwan SMTA chapter, coordinator and chair of the 2005 Nepcon Shanghai technical program, and is author of two books and over 100 technical papers.
 
He has experience in the development of solders, fluxes, high-temperature polymers, encapsulates for microelectronics, underfills and adhesives. His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on high performance and low-cost ownership.