NISKAYUNA, NY -- Binghamton University’s Integrated Electronics Engineering center (IEEC) and General Electric’s Global Research Center (GRC) have established an annual research symposium on National Trends in Small Scale Systems and Microelectronics Packaging. This year’s symposium will take place at the GE GRC facility in Niskayuna, NY, on Oct. 23-24.

It will offer information about promising new technologies and developments that are now impacting the electronics industry. Participants will receive overviews and research reports on a range of emerging technologies including: Nano Materials for Electronics, Flexible Electronics, NEMS/MEMS Developments, Optoelectronics, Sensors, Thermal Management, Sensor Packaging Integration, EcoElectronics - Lead Free Developments, BioElectronics, and Green Materials.

Approximately 150 participants, including development engineers and technical managers from major electronics companies and researchers from universities and government laboratories, will attend. Keynote presentations will provide an overview of recent developments in several areas vital to small scale systems and microelectronics packaging.

For the full program, visit:  wtsn.binghamton.edu/coned/EP06Main.htm